Research and Markets: Reverse Costing Report – Nemotek Wafer-Level Camera Shellcase MVP Wafer-Level Package – OptiMLTM Wafer-Level Optics
BY BUSINESS
Research and Markets
(http://www.researchandmarkets.com/research/twz36n/nemotek_wafer_lev) has announced the addition of the “Nemotek Wafer-Level Camera Shellcase MVP Wafer-Level Package – OptiMLTM Wafer-Level Optics – Reverse Costing Analysis” report to their offering.
Reverse costing report of the wafer-level camera supplied by Nemotek Technologie for portable applications.
– Physical Analysis of the Wafer-Level Camera
– Step by Step Reconstruction of the Process Flow
– Cost of Manufacturing and Estimation of Selling Price
The camera is built using a wafer-level packaged CMOS image sensor and wafer-level optics. Both technologies are licensed by Tessera. The wafer-level packaging of the CIS is realized with the Shellcase MVP process, using TSVs to connect the bond pads on the die and the BGA interface on the rear face of the package. The wafer-level optics is a single lens element, reflow compatible, manufactured with the OptiML WL-Optics process.
The wafer-level camera is entirely assembled by Nemotek Technologie in Morocco.
This report provides complete teardown of the camera module with:
– Detailed photos
– Material analysis
– Schematic assembly description
– Manufacturing Process Flow
– In-depth economical analysis
– Manufacturing cost breakdown
– Selling price estimation
Key Topics Covered:
1. Overview/Introduction
2. Companies Profiles
3. Physical Analysis
4. Manufacturing Process Flow
5. Cost Analysis
6. Estimated Price Analysis
Conclusion
For more information visithttp://www.researchandmarkets.com/research/twz36n/nemotek_wafer_lev
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