Monday, December 23

Comprehensive Report Covers EMEA Market for Microelectronic Industry

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Comprehensive Report Covers EMEA Market for Microelectronic Industry

By Cameron Chai

Reportlinker.com has added a new market research report titled ‘European Microelectronic Fabs Database & Report 2012’ to its offering.

This in-depth report provides data pertaining to fab locations, production facilities, research and development centers, pilot lines, technologies, products and financial information of the microelectronic industry in the European and Middle-East Area region covering the European Union and Eastern European nations, including Russia, Israel, Morocco and Turkey.

The comprehensive report is a resource for suppliers of materials and machines and all businesses associated with microelectronics production field to understand the business potential in the European and Middle-East Area market. It is a useful tool to suppliers of microsystem and microelectronic industry to know about emerging prospects in the semiconductor market in the European and Middle-East Area region.

The report includes industrial statistics for product segments such as MEMS, power devices, IC semiconductor and much more. It covers data pertaining to important changes, including fab openings and closures, new investments, and capacity expansions in the industry from 2007. For each production site, the report provides data on class and size of the clean room, technologies deployed, capacity in terms of wafer starts per month, and capacity forecast.

Products covered in the report include IC semiconductors such as ASICs, analog and mixed signal, logic, memory, and much more; MST and MEMS such as ink jet head, chemical sensor, gas sensor, IR image sensor, inertial sensor, pressure sensor, microphones, optical MEMS, oscillator, digital compass and other MEMS devices; RF devices; optoelectronics such as laser diode, LED and much more; power devices; printed electronics; concentrated photovoltaic; packaging such as wafer level packaging, zero and first-level packaging, discrete packaging and 3D packaging technique.

Companies covered in the report include IBM Microelectronics, GLOBALFOUNDRIES, First Sensor Technology, Freescale Semiconductor,EM Microelectronic Marin, Photonix, SenSonor Technologies, Telefunken Semiconductors, STMicroelectronics, Boehringer Ingelheim microParts, austriamicrosystems, Altis/GIS Semiconductor, ABB Semiconductor and more.

Source: http://www.reportlinker.com

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